Senior Engineer, Package Design

Senior Package Design Engineer - Custom SOC/ASIC Development

We are seeking an experienced Senior Package Design Engineer to join our growing custom SOC/ASIC development team. In this critical role, you'll leverage your expertise in high-performance semiconductor package design, signal integrity, and power integrity analysis to drive innovation in next-generation chip packaging solutions. You'll collaborate with cross-functional engineering teams across the U.S. and internationally to deliver cutting-edge package substrate designs for advanced applications.

Key Responsibilities

• Design and execute advanced package substrate layouts with emphasis on signal integrity (SI), power integrity (PI), and high-speed routing optimization
• Perform electromagnetic simulation and modeling using industry-standard tools including HFSS, ADS, and related EDA software
• Collaborate with layout engineers, product marketing teams, and global design centers to ensure seamless integration and optimal package performance
• Conduct pre-silicon and post-silicon analysis to validate package design performance against specifications
• Provide technical expertise during pre-sales and post-sales customer engagement processes
• Develop and maintain package design guidelines, best practices, and design rule checks (DRC)
• Lead design reviews and present technical findings to stakeholders and leadership teams

Required Qualifications

• Bachelor's degree in Electrical Engineering, Computer Engineering, or related technical field required; Master's degree strongly preferred
• 8-10 years of hands-on experience in semiconductor package design, advanced packaging, or ASIC packaging engineering
• Proven expertise in signal integrity analysis, power integrity analysis, and electromagnetic modeling techniques
• Strong proficiency with package simulation and analysis tools (HFSS, ADS, or equivalent)
• Excellent verbal and written communication skills with ability to present complex technical concepts clearly
• Demonstrated ability to work effectively in cross-functional teams and collaborative environments
• Strong problem-solving skills and attention to detail in high-performance package design

Preferred Skills and Experience

• Expert-level knowledge in high-speed package design and PCB design for SerDes, PCIe, DDR/LPDDR, Ethernet, and other high-speed interfaces
• Proficiency in time-domain and frequency-domain analysis techniques
• Experience with impedance matching, crosstalk analysis, jitter analysis, eye-diagram interpretation, and bit error rate (BER) analysis
• Hands-on experience with Hspice, Redhawk, or similar SPICE simulation tools
• Knowledge of electro-thermal simulation and power delivery network (PDN) modeling and optimization
• Familiarity with package reliability analysis, thermal management, and packaging/assembly design rules
• Experience with flip-chip, wire-bond, fan-out wafer-level packaging (FOWLP), or other advanced packaging technologies
• Background in custom ASIC or SOC development environments

Why This Is a Great Opportunity

Join a dynamic and growing semiconductor company at the forefront of custom SOC and ASIC innovation. You'll work with outstanding technology and have exceptional opportunities to expand your expertise in advanced packaging design. Our organization boasts extensive intellectual property (IP) portfolios and a collaborative culture where every team member's contributions make a meaningful impact. This is your chance to shape the future of high-performance semiconductor packaging while working alongside talented engineers on challenging and rewarding projects.

Compensation

Annual Salary Range: $190,000 - $220,000 USD, commensurate with experience and qualifications

Apply Today

If you are a skilled Package Design Engineer with a passion for semiconductor innovation and high-speed design, we want to hear from you. Join our team and make your mark in the world of custom ASIC and SOC development. Qualified candidates are encouraged to apply today to take the next step in their career.