Job Openings SMT FAE Manager | Senai

About the job SMT FAE Manager | Senai

Company Background:
Our client is a multinational cloud infrastructure technology company with a growing manufacturing footprint in Johor. The company provides advanced server and data center solutions to global customers and offers strong career growth in a stable, international environment.

Job Summary
Lead and manage the SMT repair/debug operation to ensure fast turnaround, high repair yield, and closed-loop quality improvement, supporting overall factory yield, DPPM reduction, and shipment commitments.

Key Responsibilities
Main tasks:
  • Repair & Automation Tool Implementation: Leverage repair data analysis tools to automate the generation of repair reports and facilitate preliminary defect classification.
  • Cost Management: Manage the cost of repair consumables and implement strategies to reduce scrap rates caused by human error during the repair process.
  • Customer Interaction & Communication: Proven experience in technical interfacing with internal teams/ customers, with the ability to explain Root Cause and Corrective Actions (RCCA) for quality issues effectively.
  • Training & Leadership: Demonstrated ability to train, develop, and manage both the department staff and repair technicians to ensure operational excellence.
Repair Operation Management
  • Manage daily repair station operations (post-SMT / post-AOI / post-ICT / post-FCT), Ensure:
  • Repair turnaround time (TAT) meets target
  • Repair WIP aging is controlled (no backlog > target)
  • Set up clear repair flow:
  • Incoming Diagnosis Repair Verification Closure
  • Optimize manpower allocation based on line loading and defect trend
Yield & Quality Improvement
  • Drive repair yield improvement (First Pass Repair Yield, Final Yield)
  • Monitor:
  • Top defect Pareto (daily / weekly)
  • Repeat failures / chronic issues
  • Lead root cause analysis (RCA) with cross-functional teams:
  • Process Engineering
  • Quality
  • Test (ICT/FCT)
  • Ensure zero escape of critical defects
Failure Analysis & Feedback Loop
  • Ensure all failures are:
  • Properly classified (Defect Dictionary standard)
  • Logged into system (MES / Repair system)
  • Establish strong feedback loop:
  • Repair Engineering Production Supplier
  • Escalate abnormal trends within same shift
Process Standardization
  • Define and maintain:
  • Repair SOPs / Work Instructions
  • Standard repair methods (rework profile, component handling)
  • Ensure compliance with:
  • IPC standards (IPC-A-610 / IPC-7711/7721)
  • Control:
  • ESD
  • Traceability
  • Tooling calibration
Team Leadership & Capability Building
  • Lead repair technicians and engineers
  • Build multi-skill capability:
  • Soldering / rework skill certification
  • Debug capability (schematic reading, signal tracing)
  • Set clear KPI for team:
  • Productivity
  • Accuracy
  • Discipline
  • Drive shopfloor discipline & execution speed
Data & Reporting
  • Own and publish daily/weekly reports:
  • Repair input/output
  • Repair yield
  • Top defects Pareto
  • Aging WIP
  • DPPM contribution
  • Use data to:
  • Identify top loss drivers
  • Trigger immediate containment actions
Continuous Improvement
  • Drive:
  • Repair cycle time reduction
  • False failure reduction (test vs real defect)
  • NTF (No Trouble Found) / NDF reduction
  • Participate in:
  • NPI readiness (DFx feedback)
  • Yield ramp-up activities
  • Implement Lean / Six Sigma projects
KEY KPI
Operational
  • Repair Turnaround Time (TAT)
  • Repair WIP Aging (e.g., <24/48 hrs target)
  • Productivity (units / man / shift)
Quality
  • Repair Yield (FPY / Final Yield)
  • Repeat defect rate
  • Escape rate (post-repair failure)
Improvement
  • Top defect reduction %
  • DPPM contribution reduction
  • NTF rate
Job Requirements
  • Bachelor's degree in Electronics / Electrical / Manufacturing Engineering or equivalent
  • 8–12+ years in SMT/PCBA manufacturing
  • Minimum 3–5 years in Repair / Debug / Failure Analysis leadership role
  • Experience with: AOI / ICT / FCT failure analysis; High-mix or high-volume production
  • Strong in: Circuit understanding & schematic reading; Debug tools (multimeter, oscilloscope); Rework equipment (BGA rework, soldering)
  • Familiar with: IPC standards; MES / traceability systems; SPC / data analysis
  • Strong execution mindset 
  • Cross-functional coordination ability
  • Data-driven decision making
  • Problem-solving (8D / 5Why / Fishbone)
Work Location: Senai, Johor
Salary Range: Up to RM22k

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