Manager, Product Development Engineering

About the company:

Our client is located in Penang, Malaysia, and is one of the state-of-the-art Assembly and Test service providers for high-performance computing and communication solutions. As one of the pioneer companies in Penang, their mission is to enable their global customers' success with leading-edge and differentiated high-value packaging solutions.

Job Responsibilities:

• To lead a team of product development engineers to develop and establish assembly processes recipe for new products through process characterization and process parameters optimization.
• Drive NPI to have APQP standard of handling over to HVM in meeting all KPI & Yield.
• Drive cost saving and process Cost of Ownership (COO) improvement through material selection, process cycle time improvement, productivity improvement/innovation.
• Drive Yield & Quality KPI improvement through Lean Six Sigma approach.
• Program Management of new products' introduction.
• Sense of ownership & responsibility.
• Capable high-level reporting.
• Other duties assigned by supervisor.

Job Requirements:

• Education: Degree in Engineering (Material/Mechanical/Electrical/Electronic)/Applied Science (Physic).
• Language: English (Written & Spoken).
• Experience: Knowledge of Process Control, SPC, DOE, QC Tools, FMEA, Problem Analysis.
• Knowledge of Flip Chip PGA/BGA processes.
• Experience on creating recipe for Die Attach, Reflow oven, solder printing and chip attach will be an added advantage.
• Ability to perform temperature profile characterisation for new product introduction.
• Good knowledge on SMT line/ flip chip process control / SPC/ CPK or other advanced packing competency.
• Familiar with equipment for example Datacon die attach, Heller/ BTU reflow oven and Dek solder printing or any equivalent

Remuneration:

MYR 13,000 - MYR 17,000

Consultant in charge:

Shin Yoong | shinyoong.leong@hunters-in.com | 013 863 5499