Engineer – Laser Groove

Responsibilities:

· Providing leadership in the Continuous Improvement Projects (CIP), benchmarking and fan-out and process control enhancement on assigned process (Laser Groove and Mechanical Saw Process).

· Monitor and improve Assembly Process Yield/Cycle Time and initiate quality and productivity improvement program.

· Provide engineering and technical support on Assembly Line Sustaining, New Product Development (NPI), Process Development and Machine Qualification.

· Develop evaluation, characterization and optimization plans for new assembly process and products.

· Support plant KPI and initiate development programs (e.g. Cost Savings, Capability Improvement).

· Representative during Customer Visits / Audits and Quality Systems Certification Audits.

To ensure proper division of work and responsibilities among the Process Engineers and Associate Engineers, providing proper guidance and integration of work done, ensuring good, positive and healthy working among the team of Engineers to ensure optimum productivity and efficiency.

Requirements:

· Degree in Electrical/Electronics, Engineering or equivalent

· Minimum 3 years of Engineering experience in Semiconductor manufacturing industry