Engineer – Wafer Bumping Equipment (PVD/ Descum/ Wet)

Engineer – Wafer Bumping Equipment (PVD/ Descum/ Wet)

Responsibilities:

· Lead Equipment support team for in depth technical analysis

· Carry out effective planning for CM and PM (inclusive of system setup)

· Maintain high equipment reliability with minimal resource requirement

· Equipment startup, installation and maintenance

· Troubleshooting and provide upgrade or improvement to the equipment

· Analyze equipment failure mode and carry out continuous improvement plan

· Liaising and negotiating with external party on parts enquiry and quotation

· Provide training and guidance to subordinates

· Participate OEE and capacity improvement projects

· Generating OPL and operational procedure and document in support of QMS documentation

· Parts tracking and ordering base on system

· Vendor negotiation on support and parts inventory

· ESD system setup and monitoring for all system

· Risk assessment for existing and new system

· Smart factory support and maintenance (AMR, CDS system maintenance)

Requirements:

· Degree in Engineering preferably Mechanical, Electrical, Electronics

· 3 years of relevant experience preferably in semiconductor industry

· Good problem-solving skills and communication skills