Process Engineer – Plating/ Wet

Responsibilities:

Plating Process Engineering

· Develop, implement, and optimize electroplating processes (e.g., Cu, Ni, SnAg, etc.)

· Monitor plating bath performance through regular analysis and corrective actions

· Perform DOE, capability studies, and process qualification for new plating chemistry or equipment

· Lead troubleshooting activities for plating defects such as voids, roughness, nodule formation, non-uniformity, and poor adhesion

· Establish and maintain plating process parameters, SOPs, and control plans

Wet Process Support (Etching, Cleaning, Stripping)

· Support wet etching processes (acid, alkaline, micro-etch) and ensure etch rate stability and uniformity

· Optimize surface preparation steps prior to plating such as micro-etch, oxide removal, and plasma/aquatic cleaning

· Monitor and sustain wet chemistry tanks (etchants, cleaners, developers, strippers) through SPC and scheduled chemical analysis

· Drive root-cause analysis for wet process issues including over-etch, under-etch, residue, or surface contamination

Laboratory Support

· Conduct chemical titration, CVS, TOC, and other plating bath analytical methods

· Prepare samples, test coupons, and run lab-scale plating and etching experiments

· Support failure analysis through cross-sectioning, microscopy (SEM/OM), and surface characterization

· Maintain calibration and good housekeeping of lab tools, chemical inventory, and safety compliance

Yield Improvement & Quality

· Analyze process data to identify trends and drive yield improvement actions

· Support customer audit requirements, documentation, and technical reporting

· Collaborate with Quality, Production, and R&D teams to resolve product or process quality issues

Equipment & Safety

· Support installation, preventive maintenance, and troubleshooting of plating and wet process equipment

· Ensure compliance with EHS guidelines for chemical handling, waste disposal, ventilation, and PPE usage

· Participate in safety risk assessments for chemical operations

Requirements:

· Degree in Chemical Engineering, Materials Engineering, Chemistry, or related technical field

· Experience in electroplating, Semiconductor packaging, or chemical wet processes preferred

· Knowledge of plating chemistry, solution analysis, and surface finishing technologies

· Familiarity with SPC, DOE, FMEA, and root-cause analysis tools

· Strong analytical, documentation, and problem-solving skills