Design Enablement Engineer

Role and Responsibilities

• Supervise tape-out process from customer engagement to final job-view release.
• Resolve customer queries during their design process.
• Oversee DRC review, waiver & approval, GDS preparation & floor planning for tape-out.
• Co-ordinate tape-out logistics with foundry TD, customer engineering.
• Oversee job-view and MEBES approval / release for tapeout.
• Verify component performance against design target.
• Si photonics design to enhance PDK elements for Design for Manufacturing (DFM).
• Support PDK development with Designer and Electronics Photonics Design Automation (EPDA) vendors like Ansys-Lumerical, Siemens-Mentor, Cadence or Luceda.
• Maintain & upgrade PDK to enhance competitiveness.
• Support Technology roadmap with design services.

Qualifications and Education Requirements

• PhD/Masters/Degree in Microelectronics/Electrical/Electronic Engineering/Physics/Material Science.
• At least 5 years relevant experience in Design Enablement and / or Tape-out Operations working with foundry customers.
• Si photonics knowledge preferred but not mandatory.
• Good interpersonal, effective presentation and communication skills.

Additional Attributes

• Exhibit Initiative, ownership, accountability and a team player.
• Able to perform under a fast paced and challenging environment.
• Demonstrate strong problem-solving skills.