Maintenance Engineer - Electronics Manufacturing

• Supervise and provide technical support for maintenance activities on Dicing, Die Bonding, and Wire Bonding machines to ensure smooth operation and minimize equipment downtime. 
• Lead improvement initiatives on key maintenance performance indicators, including MTBF (Mean Time Between Failures), MTTR (Mean Time to Repair), and OEE (Overall Equipment Effectiveness), to enhance machine reliability and efficiency. 
• Perform root cause analysis on equipment defects and implement corrective and preventive measures to reduce recurring issues and improve production quality. 
• Manage spare parts inventory, ensuring critical components are available for timely maintenance and minimizing delays caused by part shortage. 

Qualifications: 

• Bachelors degree in Mechanical or Electronic Engineering
• 5+ years experience in semiconductor maintenance
• Knowledge of IC packaging (Dicing, Die Bonding, Wire Bonding)
• Skilled in machine repair and defect analysis