1. knowledge of process from water taping to tape and reel packout, 8 and 12 inch wafers
2. Key area, wafer taping, Backgrind, laser groove , mechanical Sawing, Laser mark, Backside Lamination, AOI , tape and reel.

Tools knowledge
1. Lintec taper,
2. Disco Backgrinder
3. Disco Mounter (DFM2800)
4. Dynatech wafer mounter, detaper
5. EO laser Marker
6. Lintec BSC
7. Disco Saw
8. Onto , Camtek AOI
9. MIT and STI tape and reel mcs

Soft skill
1. 8D analysis to resolve problem
2. Data analytical skills
3. Design of Exorriment
4. FMEA

All Successful candidates can expect a very competitive remuneration package and a comprehensive range of benefits.

Please email your resume in a detailed MS Word format to joyce@peopleprofilers.com stating

1) Current Drawn

2) Expecting Salary

3) Date Available

4) Reason to Leave each job:

We regret that only shortlisted candidates will be notified

Joyce Koh Ai Leng

People Profilers Pte Ltd

20 Cecil St, #08-09, PLUS Building, Singapore 049705

Tel: 6950 9737

www.peopleprofilers.com

EA License Number: 02C4944

EA Personnel Reg nos R1110618

Job Id :