Description:
Summary The WLP Development Engineer will support R&D and process integration activities for 2.5D wafer-level packaging (WLP) technologies, focusing on Die Preparation , Chip Attach , and Molding processes. The role ensures process reliability, manufacturability, and seamless integration for next-generation semiconductor packages used in AI, HPC, and memory applications . Key Responsibilities Develop and optimize Chip-on-Wafer (CoW) processes: Die Preparation: grinding, laser grooving, dicing saw Chip Attach: Thermo-Compression Bonding (TCB), …