Job Responsibilities

• Lead the development and optimization of Solder Plating and Nickel Plating processes in collaboration with the R&D team.
• Establish and sustain high-volume manufacturing capabilities for solder and nickel plating processes.
• Develop and qualify new process recipes for each new device.
• Perform process characterization including bump dimensions, bump shear strength, and void analysis.
• Monitor and control process parameters such as bath concentration, lifespan, condition (Solder/Nickel/Cu), plating uniformity, and overall plating quality.
• Serve as backup support for Cu plating processes (IPD and RDL), including new device characterization and chemical bath monitoring.
• Collaborate with the Solder Reflow Engineer to develop and optimize flux coating and solder reflow processes for plated solder bumps.
• Create new recipes for flux coating and reflow.
• Conduct characterization for various bump dimensions and solder/nickel compositions, including flux coverage/height, bump geometry, shear strength, void performance, and visual appearance.
• Lead and drive cost reduction and quality improvement initiatives.

Requirements

• Bachelor’s Degree in Chemistry, Chemical Engineering, or a related field.
• Minimum 2 years of relevant experience in solder plating, nickel plating, wafer bumping, or wafer fabrication (preferred).
• Working knowledge of Statistical Process Control (SPC) and JMP software.

All Successful candidates can expect a very competitive remuneration package and a comprehensive range of benefits.

Please email your resume in a detailed MS Word format to joyce@peopleprofilers.com stating

1) Current Drawn

2) Expecting Salary

3) Date Available

4) Reason to Leave each job:

We regret that only shortlisted candidates will be notified

Joyce Koh Ai Leng

People Profilers Pte Ltd

20 Cecil St, #08-09, PLUS Building, Singapore 049705

Tel: 6950 9737

www.peopleprofilers.com

EA License Number: 02C4944

EA Personnel Reg nos R1110618

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