Description:
1. knowledge of process from water taping to tape and reel packout, 8 and 12 inch wafers 2. Key area, wafer taping, Backgrind, laser groove , mechanical Sawing, Laser mark, Backside Lamination, AOI , tape and reel. Tools knowledge 1. Lintec taper, 2. Disco Backgrinder 3. Disco Mounter (DFM2800) 4. Dynatech wafer mounter, detaper 5. EO laser Marker 6. Lintec BSC 7. Disco Saw 8. Onto , Camtek AOI 9. …